3D Structural Electronics
Odyssian Technology has a patent on Multifunctional Composite Sandwich Element with Embedded Electronics. As a product offering, Odyssian provides services in designing and developing structural electronics having sandwich or multi-board construction. This technology structurally integrates conventional hard substrate circuits, flex circuits, &/or printed polymer circuits into conventional or composite structure.
Enclosed sandwich PCB technology is well suited for protecting circuits against:
· Distortion or via cracking due to thermal swings
· Circuit failure from exposure to high levels of radiation
· Mechanical failure from exposure to vibration
· Shorting/overheating from exposure to dirty environment
· Tampering or reverse engineering.