3D Structural Electronics                   

Odyssian Technology has a patent on Multifunctional Composite Sandwich Element with Embedded Electronics.  As a product offering, Odyssian provides services in designing and developing structural electronics having sandwich or multi-board construction. This technology structurally integrates conventional hard substrate circuits, flex circuits, &/or printed polymer circuits into conventional or composite structure.

Enclosed sandwich PCB technology is well suited for protecting circuits against:

·         Distortion or via cracking due to thermal swings

·         Circuit failure from exposure to high levels of radiation

·         Mechanical failure from exposure to vibration

·         Shorting/overheating from exposure to dirty environment

·         Tampering or reverse engineering.

 

Text Box: Patent # US 7,349,225 B1